Semiconductor & Photonics
Where We Come In

• Custom Substrates, Experimental Materials, Low-Volume Builds, Integrate new materials, Route High-Density Layers.

• Glass and Ceramic Interposers with Multilayer RDLs

• Polyimide and PBO Dielectric Stacks

• Diamond and AlN Substrates for Thermal Management

• Custom Fab Flows and Process Tuning for Emerging Materials

Why it matters
You get fast, clean builds without fighting a system built for high-volume silicon.
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Aerospace
Where We Come In

• Space Systems are pushed to the edge—Tight Size, Weight, and Power Budgets. 

• Filled-via ceramic interposers that support SWaP constraints

• AlN substrates for thermal management

• Clean, Traceable Processes aligned with Qualification Environments

• Support from Prototype to Qualified Builds

Why it matters
You move from Design to Deployment —and clearer visibility across your Build Process.
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RF & Microwave
Where We Come In

• High-Frequency Circuits often perform well in simulation—but fail in the real world due to parasitics, crosstalk, or grounding issues. At scale, even small layout imperfections can crush yield.

• Thin-Film Networks for Filters, Dividers, and Couplers

• Air Bridges and Filled Vias for Signal Integrity

• RF-Optimized Substrates like Alumina, AlN, and Quartz

Why it matters
Your Circuit performs as Designed— during Validation or Production.
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Life Sciences (Emerging Applications)

Where We Come In

• Implants, Biosensors, and Diagnostic Systems R&D, fabrication partners.

• Familiarity with Sapphire, Glass, and Gold-Filled Vias for near Hermetic Builds, Microfluidics and Flow Cells.

• Kapton film and Multilayer Polyimide for Flexible Medical Imaging

Why it matters
If you're developing the next generation of medical or diagnostic systems, we can support early prototyping and process exploration.

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