Precision power dividers boost RF signal integrity—reducing loss, improving isolation, and ensuring phase balance for radar, 5G, and more.

Don’t Just Design. Design for Reality. A design isn’t just a drawing or a simulation—it’s a promise . A promise that the device will...

Filled vias are solid metal connections through advanced substrates like ceramic or glass—ideal for high-power, high-frequency, or mission-critical designs. Plated vias, with metal-lined walls, are simpler and cheaper but offer less conductivity and thermal performance. Choosing between them isn’t just technical—it’s strategic. Like a strong foundation, filled vias offer depth and reliability when your design truly demands it.

Photosensitive polyimides (PSPIs) are transforming RF microsystem design by enabling high-frequency performance, compact layouts, and simplified manufacturing. With their low dielectric constant, excellent thermal stability, and UV-patternable nature, PSPIs are ideal for RF filters, interconnects, and advanced packaging. As systems push into 6G and terahertz domains, PSPIs are proving to be an invisible yet indispensable design advantage.

At GHz speeds, even the cleanest schematic can fall apart if the layout isn’t field-aware. In thin-film circuits, every trace radiates, every gap couples, and parasitic effects can quietly sabotage performance. This guide breaks down what causes crosstalk and parasitics, why thin-film designs are especially vulnerable, and five proven strategies to stop them—before they cost you compliance, yield, or time.

Aluminum Nitride cools like metal, insulates like rubber, and enables high-frequency RF—thanks to its crystal structure and phonons.

Learn how thin film filters power RF systems with atomic precision—from substrates to ALD, photolithography, and advanced materials.