Filled vias are solid metal connections through advanced substrates like ceramic or glass—ideal for high-power, high-frequency, or mission-critical designs. Plated vias, with metal-lined walls, are simpler and cheaper but offer less conductivity and thermal performance. Choosing between them isn’t just technical—it’s strategic. Like a strong foundation, filled vias offer depth and reliability when your design truly demands it.

Photosensitive polyimides (PSPIs) are transforming RF microsystem design by enabling high-frequency performance, compact layouts, and simplified manufacturing. With their low dielectric constant, excellent thermal stability, and UV-patternable nature, PSPIs are ideal for RF filters, interconnects, and advanced packaging. As systems push into 6G and terahertz domains, PSPIs are proving to be an invisible yet indispensable design advantage.

Harnessing plasmas for microfabrication unlocks unmatched precision in nanotech, revolutionizing electronics and beyond. #PlasmaPrecision

Filled vias offer better electrical conductivity, thermal performance, and mechanical strength than plated through vias, but they are more e

HD-8820, a versatile PBO precursor with impressive mechanical properties, heat resistance, low water absorption, and dielectric properties.

Glass substrates are poised to play a crucial role in next-gen electronic packaging. They offer numerous advantages, including high thermal

Thru glass vias (TGVs) allow for more connections between different layers of circuitry, which can lead to smaller and more powerful devices

Glass-based IPDs are a promising technology for high-frequency applications.

RDL technology is a key enabler for advanced interposer design. It improves signal integrity, reduces size, and increases flexibility.

Laser drilling glass vias can be done via ablation or vaporization. Ablation is for small holes, vaporization for large.

Lasers can induce structural changes in glass, such as crystallization, phase transitions, and network rearrangement.

Glass interposer fabrication advances enable smaller, more functional, and high-performance electronic devices. #Glass Interposer